A Study on Slicing Performance of Work Rotating Type Multi-Wire Saw
نویسندگان
چکیده
منابع مشابه
Wafer Slicing and Wire Saw Manufacturing Technology
Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...
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Experimental study on slicing of sapphire with fixed abrasive diamond wire saw was conducted in this paper. The process parameters were optimized through orthogonal experiment of three factors and four levels. The effects of wire speed, feed speed and tension pressure on the surface roughness were analyzed. Surface roughness in cutting direction and feed direction were both detected. The result...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering, Contributed Papers
سال: 2005
ISSN: 1881-8722,1348-8724
DOI: 10.2493/jspe.71.486